ACRC

Advanced Circuit Research Center

 

Please, Register Online!

You are kindly invited to:
3-Dimensional VLSI Circuits, Challenges&Opportunities
Thursday, February 24, 2011, 14:15 - 17:30
Auditorium Floor 10, Electrical Engineering Building, Technion

 

Schedule

14:15 - 14:30

Registration & Light Refreshments

14:30 - 15:10

Recent Research in 3-D Circuit Design and Related Test Circuits
Prof. Eby G. Friedman, University of Rochester, NY, USA


15:10 - 15:50

Variability Issues in 3-D Clock Distribution Networks
Prof. Vasilis Pavlidis, EPFL, Switzerland


15:50 - 16:10

Coffee Break

16:10 - 16:50

Design and Modeling Methodology of Vertical Interconnects (TSV, mC4...) for 3DI technologies in IBM
Dr. David Goren, IBM, Israel


16:50 - 17:30

Cost Effectiveness of 3D Integration Options
Prof. Dimitrios Velenis, IMEC, Belgium


For more information please call Gitta Abraham: 04-8294674

gitta@ee.technion.ac.il

Registration Form

 

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